Prototype&Production Capabilities

BQ Tech has been deeply engaged in PCB prototype and small-batch manufacturing for over 15 years. Leveraging reliable delivery performance and continuous technological advancement, the company has grown into a leading supplier in this field. Since 2017, BQ Tech has strategically focused on high-end HDI technology, making sustained investments and capability upgrades to establish a leading position in HDI prototype and small-volume manufacturing, built on advanced processes, fast turnaround, and consistent quality.

Manufacturing Capability

Printed Circuit Board

Items	Standard	Prototype
Maximum Layer Count	36	60
Maximum Board Thickness	6 mm	8 mm
Outer Layer Line Width / Spacing	3.5 / 3.5 mil	3.0 / 3.5 mil
Inner Layer Line Width / Spacing [1 oz Cu]	3.5 / 3.5 mil	3.0 / 3.5 mil
Inner Layer Line Width / Spacing [H oz Cu]	2.8 / 2.8 mil	2.5 / 2.5 mil
Line Width / Spacing [2 oz Cu]	6/6mil	5.5/5.5mil
Line Width / Spacing [3 oz Cu]	8/8mil	7/7mil
Line Width / Spacing [4 oz Cu]	10/10mil	9/9mil
Line Width / Spacing [5 oz Cu]	12/12mil	11/11mil
Line Width / Spacing [6 oz Cu]	14/14mil	13/13mil
Aspect Ratio	20:1	25:1
HDI Structure	3 + N + 3	7 + N + 7
Differential Impedance Tolerance	±10% (Inner Layer, 1 oz Cu)	±5% (Inner Layer, 1 oz Cu)
Gold Finger Bevel Tolerance	±0.075 mm	±0.05 mm
Registration Accuracy	4.5 mil	4 mil
Maximum Back Drill Stub	8 mil	6 mil
Minimum Drill Hole Diameter	7 mil	7 mil
Surface Treatment	ENIG,HASL (with/without lead),OSP,Immersion Tin,Immersion Silver,ENEPIG,Gold Fingers,Selective Gold

Rigid-Flex Board

Item		Standard	Prototype
Layer Count	Flexible Area	Max 10 Layers	Max 20 Layers
Layer Count	Rigid Area	Max 14 Layers	Max 26 Layers
Board Thickness	Flexible Area	Min 0.15 mm	Min 0.10 mm
Board Thickness	Rigid Area	0.6 – 2.0 mm	0.5 – 6.0 mm
Copper Thickness	Inner Layers	Max 1 oz	Max 2 oz
Copper Thickness	Outer Layers	0.5 – 1 oz	0.5 – 6 oz
Maximum Size	Panel Size	220 × 450 mm	280 × 810 mm
Minimum Line Width / Spacing	Inner Layers	4 / 4 mil	2.5 / 2.5 mil
Minimum Line Width / Spacing	Outer Layers	4 / 4 mil	2.5 / 2.5 mil
Minimum Hole Size / Pad	Flexible Area	0.15 mm / 0.45 mm	0.15 mm / 0.45 mm
Minimum Hole Size / Pad	Rigid Area	0.20 mm / 0.50 mm	0.15 mm / 0.40 mm
Aspect Ratio	Laser Via	0.8 : 1	1:01
Aspect Ratio	Mechanical Through Hole	12:01	15:01
Minimum Dielectric Thickness	Inner Layer Flexible Core	0.025 mm	0.0125 mm
	Inner Layer Rigid Core	0.1 mm	0.1 mm
	Prepreg	0.075 mm	0.05 mm
Dimensional Tolerance	Rigid Area Outline	±0.15 mm	±0.10 mm
Dimensional Tolerance	Flexible Area Outline	±0.10 mm	±0.075 mm
Minimum Flexible Board Length		2 mm	2 mm
HDI Capability		3 + N + 3	5 + N + 5
Minimum Hole-to-Trace		7 mil	5 mil
Minimum Hole-to-Flex-Rigid Edge		≥1.0 mm	≥0.8 mm
Surface Treatment		ENIG, Electrolytic Gold, HASL (with/without lead), OSP, Immersion Tin, ENEPIG, Immersion Silver

Material

Porduct	CCL Supplier	Laminate Model	Feature	Application
PCB		S1000-2M	High Tg, High Performance, Low CTE	Computer，Communication，Automotive electronics，Suitable for high multilayer PCB
		S1000H	High Performance, Mid-Tg, Lead-free	Instruments，Computer，Consumer electronics，Automotive electronics，Power supplier and Industrial
		S1150G	Halogen-free, Mid-Tg	LED，Tablet，Smartphone，Automotive electronics，Communication equipment
		S1170G	High Tg, Halogen-free	Computer，Instrument，Smartphone，Consumer electronics，Automotive electronics
		ThunderClad 1+	High Tg， halogen free， low loss	Backplane，Servers, Telecom, Base station，High performance computing
		ThunderClad 2	High Tg， halogen free， low loss	Radio frequency，Backplane，Servers, Telecom, Base station，High performance computing
		ThunderClad 3+	PTFE-based, hydrocarbon-based very low loss materials	Radio frequency，Backplane，Servers, Telecom, Base station，High performance computing
		TU-768	High Tg	Consumer Electronics，Server, workstation，Automotive electronics
		TU-862 HF	High Tg，Halogen Free	Backpanel，Servers, Telecom, Base station，Office Routers，High performance computing
		TU-872 SLK	Low Dk，Low Df	Radio frequency，Backplane，Servers, Telecom, Base station，High performance computing
		RO4350B/RO4003C	Low Dk，Low Df	Cellular Base Station Antennas，Power Amplifiers，RFIDAutomotive Radar and Sensors, LNBs
		RO3003	Low Dk，Low Df	Direct broadcast satellites,power amplifiers and antennas,Remote meter readers,Patch antenna for wireless communications,Automotive radar applications
FPC		AP8515R	PI=1mil,CU=0.5/0.5 OZ	/
		AP8525R	PI=2mil,CU=0.5/0.5 OZ	/
		AP8535R	PI=3mil,CU=0.5/0.5 OZ	/
		AP9121R	PI=2mil,CU=1/1 OZ	/
		AP9131R	PI=3mil,CU=1/1 OZ	/
		R-F775 12RB-M	PI=1mil,CU=0.5/0.5 OZ	/
		R-F775 11RB-M	PI=1mil,CU=1/1 OZ	/
		R-F775 22RB-M	PI=2mil,CU=0.5/0.5 OZ	/
		R-F775 21RB-M	PI=2mil,CU=1/1 OZ	/
		AS2L-AD250BU	PI=1mil,CU=0.5/0.5 OZ	/
		AS2L-AD500BU	PI=2mil,CU=0.5/0.5 OZ	/
		AS2L-AD750BU	PI=3mil,CU=0.5/0.5 OZ	/
		AS2L-AD251BE	PI=1mil,CU=1/1 OZ	/
		AS2L-AD501BE	PI=2mil,CU=1/1 OZ	/
		AS2L-AD751BE	PI=3mil,CU=1/1 OZ	/