20 Layers
  • Application:Semiconductor Testing
  • Layer Count:20 layers
  • Material:S1000-2M
  • Minimum Trace/Space:0.1/0.09mm
16 Layers
  • Application:Semiconductor Testing
  • Layer Count: 16 layers
  • PCB Size:550x850mm
  • Thickness:3.0mm
  • Surface Treatment:Gold Plating50u"
16 Layers
  • Product:Rigid-Flex Board
  • Material:S1000-2+AS2L-AD750BU 
  • Layer Count: 16 layers
  • Flex Part:4 layers
  • 1-4 & 9-12 blind vias
16 Layers
  • Product:Rigid-Flex Board
  • Material:TU-872SLK+AP8535R 
  • Layer Count: 16 layers
  • Flex part:12 layers
  • Surface Treatment:ENIG 2u"
16 Layers
  • Application:Server
  • Layer Count: 16 layers
  • HDI Structure:1-step HDI
  • Material:TU-872SLK   
  • Surface Treatment:ENIG+Stepped Gold Fingers
  • Aspect Ratio :14:1    
  • Minimum Trace/Space:0.075/0.075mm
20 Layers
  • Application:Server:Power Supply Board for Semiconductor Equipment
  • Layer Count: 20 layers
  • Material:S1000-2m
  • Inner/Outer Layer Copper Thickness:4oz
  • PTH Copper:50um
  • PCB Size:455*455mm
  • Board Thickness:8.5mm
22 Layers
  • Application:Communication
  • Layer Count: 22 layers
  • HDI Structure:2-step HDI
  • Material:R04350+TU872SLK    
  • Impedance Tolerance:±10%
  • Aspect Ratio :12:1
6 Layers
  • Application:Optical Module
  • Layer Count: 6 layers
  • Material:IT-988SE
  • Surface Treatment:ENEPIG  
  • Impedance Tolerance:±8%    
  • Minimum Trace/Space:0.09/0.08mm 
8 Layers
  • Application:Chip Storage
  • Layer Count:8 layers
  • HDI Structure:3-step HDI
  • Material:R5775G
  • Thickness:2.0mm
  • Minimum Copper-to-Drill Edge Clearance:0.13mm
  • Minimum Trace/Space:0.08/0.075mm
  • Surface Treatment:ENIG 2u"
10 Layers
  • Application:Chip Storage
  • Layer Count:10 layers
  • HDI Structure:4-step HDI
  • Material:S1000-2M
  • Minimum Trace/Space:0.064/0.025mm
  • Surface Treatment:ENIG 2u"
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