8 Layers
- Application：Chip Storage
- Layer Count：8 layers
- HDI Structure：3-step HDI
- Material：R5775G
- Thickness：2.0mm
- Minimum Copper-to-Drill Edge Clearance:0.13mm
- Minimum Trace/Space：0.08/0.075mm
- Surface Treatment：ENIG 2u"
Classification:
Keyword: 8 Layers
- Product Description
-
- Commodity name: 8 Layers
<ul> <li>Application：Chip Storage</li> <li>Layer Count：8 layers</li> <li>HDI Structure：3-step HDI</li> <li>Material：R5775G</li> <li>Thickness：2.0mm</li> <li>Minimum Copper-to-Drill Edge Clearance:0.13mm</li> <li>Minimum Trace/Space：0.08/0.075mm</li> <li>Surface Treatment：ENIG 2u"</li> </ul>
- Application：Chip Storage
- Layer Count：8 layers
- HDI Structure：3-step HDI
- Material：R5775G
- Thickness：2.0mm
- Minimum Copper-to-Drill Edge Clearance:0.13mm
- Minimum Trace/Space：0.08/0.075mm
- Surface Treatment：ENIG 2u"
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